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DAE Technology Code

Name of Technology

Brief Description

EG01PIHUB

Single Stage 30 K Class Cryocooler with Helium Compressor

Single stage 30 K class cryocooler with Helium compressor are key component in various commercial and industrial applications. The developed technology deploys Gifford McMahon cycle to achieve ultra-low temperature at it’s cold finger.

EG02PIHUB

250 W average power fiber coupled pulsed Nd:YAG laser with workstation

This developed 250W average power, fiber-coupled pulsed Nd:YAG laser can be used for precise material processing. The integrated workstation facilitates various applications, including - cutting and welding.

EG03PIHUB

Laser Additive Manufacturing System using Powder Bed Fusion System (LAM-PBF)

The developed LAM-PBF technology uses a laser to selectively melt and fuse layers of powder, building complex 3D metal parts. This technology enables the creation of intricate geometries for high-value applications across industries.

EG11RRCAT

RF/Microwave Substrates

An import substitute product extensively used for variety of high-end microwave circuit applications such as high-power solid-state amplifiers, patch antennas, mobile base stations etc.

EG16RRCAT

Sheetal Vahak Yantra (SHIVAY)

Liquid Nitrogen Based Transportable Refrigeration System- Sheetal Vahak Yantra (SHIVAY) intended for transportation of fruits vegetables & Pharmaceuticals products caters up-to requirement of minus 40 °C temperatures.

EG18RRCAT

Sheetal Vahak Yantra (SHIVAY-V)

Liquid Nitrogen Based Transportable Refrigeration System- Sheetal Vahak Yantra (SHIVAY-V) for transportation pharmaceutical products (including vaccines) at any temperature, up-to minus 70 °C.

EG34RRCAT

Laser additive manufacturing system using powder-fed Direct Energy Deposition (LAM-PF-DED)

Laser Additive Manufacturing (LAM) has brought a paradigm shift to “feature based design and manufacturing” and is being considered as an integral part of fourth industrial revolution.

EG35RRCAT

Bonding and Packaging, and Testing Technology of High-Power Laser Diode Arrays for Diode Pumped Solid State Laser Module

Technology for the bonding and packaging of high-power laser diode arrays