Diode pumped intracavity frequency doubled pulsed solid state green laser (DPSS-GL) |
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Diode pumped solid state (DPSS) pulsed green laser is highly useful for micromachining of copper, scribing of silicon wafers, pumping of tunable dye or Ti:sapphire laser, LiDAR, atmospheric science, medical science and other branches of science and technology. The DPSS green laser developed here is a specially designed Q-switched intracavity frequency doubled Diode-pumped Nd:YAG laser delivering high average power (~50 W) at 532 nm with short pulse duration (<45 ns) under high repetition rate (6-10 kHz). The output beam is circular (M2 ~25) and the laser exhibits excellent long term power stability ( ±1.0 W), low timing jitter (±3 ns) and high beam pointing stability (±2 µrad). The laser system incorporates all the major operational features and safety interlocks and can be easily synchronized with other pulsed laser system. This laser is capable of micromachining of high reflectivity material like copper, scribing of silicon wafer and cutting and polishing of diamonds. Fabrication and assembly of laser micromachining head will also be part of technology transfer.
Detail Technical Brochure
Detailed Technical Brochure
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1. Product Technical Specification
S. No. |
Description |
Value |
a. |
Laser Type |
Repetitively Q-swithched Diode Pumped intracavity |
b. |
Wavelength |
532 nm |
c. |
Max. Avg. Power |
50 W |
d. |
Pulse duration (typical) |
50 ns |
e. |
Pulse rise time |
25 ns (10%-90% of peak, at maximum output power) |
f. |
Pulse fall time |
60 ns (90%-10% of peak, at maximum output power) |
g. |
Pulse repetition rate |
6-10 kHz (internal/external triggerable) |
h. |
Pulse energy (typical) |
5 mJ |
i. |
Peak Power (typical) |
100 kW |
j. |
Input pump power |
750 W |
k. |
Average power stability |
<5% (over 8 hrs) |
l. |
M2- Parameter |
25 |
m. |
Beam divergence |
4.0 mrad (half angle) |
n. |
Beam Pointing stability |
±2 μrad |
o. |
Pulse to pulse timing jitter |
±3 ns |
p. |
Output beam polarization |
Vertical (50:1) |
q. |
Beam delivery |
free space or 400 μm fiber |
Safety interlocks:
1. For flow rate: If water flow from the chiller is stopped or flow rate is reduced then the laser system will be automatically switched off.
2. Laser will not be ON if RF driver or trigger is not ON.
3. The laser diodes will be automatically shorted when the laser is switched OFF
Additional requirements for laser micromaching:
1. Micromachining head including focusing optics, nozzle and gas flow
2. XY-table or CNC workstation for micromaching
3. High pressure gas (compressed air at ~ 10 bar)
4. For high quality micromachining vacuum chamber/inert atmosphere with argon purging
2. Typical End Applications
1. Pumping of tunable dye and Ti:sapphire laser and amplifier.
2. Micromaching of high reflectivity materials like copper.
3. Scribing of silicon semiconductor wafer.
4. Cutting and polishing of diamonds.
5. Pulsed UV source generation.
6. LiDAR, Atmospheric science and in other scientific/research applications.
3. Facilities Required for Commercial Production
1. Fabrication facility of mechanical components
2. Clean room for assembly of laser components.
3. Electronics wiring facility
4. Laser characterization equipment such as power meter, beam profiler, Oscilloscope
4. Manpower Requirement
S. No |
Designation |
Nos. |
a. |
Engineers, one having M. Tech./M.Sc. degree in physics with optoelectronics specialization and another having B. Tech./ M. Tech. degree in Electrical/Electronics. |
2 |
b. |
ITI trained technician (trade-fitter) with minimum 2 years work experience |
1 |
c. |
ITI trained technician (electronics) with 2 years of work experience in the field wiring of electronic instruments and PCB soldering. The Person having diploma in Electronics/Electrical/Instrumentation Engineering is preferred. |
1 |